nine hundred
Technical parameter table:
nine hundred and one
Tested after curing for 7 days at 25 ℃ and 50% relative humidity.
Product Description:
HY484 epoxy sealant is a two-component, self leveling, room temperature curing epoxy resin sealant material with excellent aging resistance, moisture resistance, electrical insulation, high hardness, and high breakdown voltage. Suitable for various casting, bonding, and sealing of electronic components.
Application scope:
HY484T: Encapsulation of electronic components and modules with transparency requirements, suitable for room temperature encapsulation of digital tubes.
HY484P: Used for general electronic component encapsulation and circuit board enclosure protection.
HY484L: Used for general electronic component encapsulation and circuit board enclosure protection.
HY484D: Used for encapsulation and protection of modules and circuit boards with high requirements for heat dissipation and flame retardancy in high-power electronic components.
Product Features:
♦ Solvent free, environmentally friendly and low-carbon
♦ Weather resistance, aging resistance, UV resistance
♦ Has sexual insulation, moisture resistance, and earthquake resistance
♦ Suitable for potting and sealing electronic components
♦ non-corrosiveness
Curing mechanism:
HY484 is an epoxy potting material, and its curing mechanism is to react with a curing agent to solidify and become an elastic solid. The higher the temperature and humidity, the faster the curing process; The curing speed is slow in low temperature and low humidity environments.
Chemical resistant medium:
The product can withstand freshwater, sewage, wastewater, calcium carbonate aqueous solution, cleaning agents, low acidity, corrosive aqueous solution, etc. for a long time, and can withstand mineral oil, vegetable oil, fat, fuel, etc. for a short time. It is not resistant to organic solvents, paint thinners, high concentrations of acid and alkali, etc.
usage method:
preparation in advance
Ensure that the sealing surface is free of oil stains and dust. Long term storage is prone to delamination due to the high density of Group A. Before use, it should be stirred evenly without affecting product performance.
Mixed adhesive solution
Add curing agent B to the adhesive material in proportion, stir and pour in at the same time, pay attention to scraping the wall, stir evenly, and ensure consistent color.
The mixed adhesive should be used up within 0.5 hours.
Automatic mixing and filling machine can be used!
matters needing attention:
♦ Long term storage is prone to delamination due to the high density of Group A. Before use, it should be stirred evenly without affecting product performance. Apply glue in a ventilated environment
♦ The mixed adhesive should be used up in one go, and the unused adhesive and curing agent should be sealed and stored.
♦ The general sealing thickness is within 30mm, and for deep sealing, please contact the company.
Packaging specifications:
12kg/set 24kg/set
Storage method:
Store at 10-30 ℃, seal and store in a cool and dry place, with a shelf life of six months.