nine hundred
Technical parameter table:
nine hundred and one thousand nine hundred and two
Tested after curing for 7 days at 25 ℃ and 50% relative humidity.
Product Description:
HY585 silicone sealant is a type of two-component, room temperature cured, addition molded silicone sealant material. Self leveling, high and low temperature resistance, excellent aging resistance, insulation, moisture resistance, and earthquake resistance. Applied to various adhesives and seals of electronic components.
Product Features:
♦ Solvent free, environmentally friendly and low-carbon
♦ Weather resistance, aging resistance, and UV resistance
♦ Has sexual insulation, moisture resistance, and earthquake resistance
♦ Suitable for potting and sealing electronic components
♦ non-corrosiveness
Application scope:
HY5850 silicon gel is suitable for sealing protection of various electronic components, especially precision electronic components.
HY585T is suitable for potting and sealing electronic components with transparency requirements.
HY584D is suitable for various potting and sealing of electronic components with thermal conductivity and flame retardant requirements.
HY584H is suitable for potting and sealing electronic components with high thermal conductivity requirements.
Curing mechanism:
  HY585 is an organic silicon potting material, and its curing mechanism is to react with a curing agent to solidify and become an elastic solid. The higher the temperature and humidity, the faster the curing process; The curing speed is slow in low temperature and low humidity environments.
Chemical resistant medium:
  The product can withstand freshwater, sewage, wastewater, calcium carbonate aqueous solution, cleaning agents, low acidity, corrosive aqueous solution, etc. for a long time, and can withstand mineral oil, vegetable oil, fat, fuel, etc. for a short time. It is not resistant to organic solvents, paint thinners, high concentrations of acid and alkali, etc.
Usage:
  Preliminary preparation

  Ensure that the sealing surface is free of oil stains and dust. Long term storage is prone to layering due to its high specific gravity. Before use, it should be stirred evenly without affecting product performance.
  Mixed adhesive solution

  According to the mass ratio (or volume ratio) of adhesive A to curing agent B=1:1, it is better to mix evenly and have consistent color. The mixed adhesive should be used up within 1 hour.
  Glue curing

  Inject the evenly mixed adhesive into the components with a slow flow to avoid gas entrapment.
  Full solid at room temperature for 24 hours; Heating at 60 degrees for 40 minutes to achieve full solidification; Heat at 80 degrees for 20 minutes to achieve full solidification.
  After curing, use a blade to clean excess adhesive residue.
  Automatic mixing and filling machine can be used!
matters needing attention:
♦ Long term storage: As AB group is a thermal conductive material with a high specific gravity, it is prone to delamination. Before use, it should be stirred evenly without affecting product performance. Apply glue in a well ventilated environment.
♦ The mixed adhesive should be used up in one go, and the unused adhesive and curing agent should be sealed and stored.
♦ The adhesive solution should avoid contact with the following materials: organic tin compounds and silicone rubber containing organic tin, sulfur, sulfides, and sulfur-containing rubber materials, amine compounds, and materials containing amines; Otherwise, non solidification may occur.
♦ Sealed storage in a cool place, with a storage period of six months.
Packaging specifications:
HY5850 and HY585T: 30kg/set
HY585D and HY585H: 20kg/set, 40kg/set
Safety and hygiene:
  HY585 product has no toxic effects and is the same as general chemicals. It cannot come into contact with food or food utensils. It is recommended to maintain sufficient ventilation in the work environment. In case of entering the eyes or mouth, rinse immediately with water. Store in a safe place, away from children.
Declaration:
  The technical parameters mentioned in this article are typical values and are not used as product acceptance criteria. They are for reference only. The above data was obtained under standard laboratory conditions, and our company guarantees its reliability. However, due to different working conditions used by users, different surface states of materials, and different curing conditions, some changes in actual performance data are normal phenomena. Storage conditions, transportation, and other factors can all affect the stability, physical and mechanical properties of the adhesive. We are not responsible for any results obtained by anyone using methods beyond our control. It is recommended that users conduct experiments based on the data provided in this article before formal use.
Technical consultation hotline: 0371-65336655