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5541 epoxy patch red adhesive
5541 epoxy patch red adhesive has a fast curing speed. Epoxy patch adhesive has a very wide range of applications, even with high-speed coating and small amounts of coating, it can still maintain no wire drawing, tailing, or collapse, and has good adhesive point stability. SMT epoxy patch adhesive has extremely low moisture absorption, and is not prone to bubbles or insufficient adhesion under rapid heating and very short curing time. 5541 epoxy adhesive also has high strength, heat resistance, and excellent electrical characteristics. Recommended curing conditions for epoxy patch red adhesive are 150 ° C for 90-120 seconds or 120 ° C for 160-180 seconds, with higher curing temperatures not exceeding 200 ° C
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Product information:< br />
& nbsp; & nbsp; 5541 epoxy patch red adhesive has a fast curing speed. Epoxy patch adhesive has a very wide range of applications, even with high-speed coating and small amounts of coating, it can still maintain no wire drawing, tailing, or collapse, and has good adhesive point stability. SMT epoxy patch adhesive has extremely low moisture absorption, and is not prone to bubbles or insufficient adhesion under rapid heating and very short curing time. 5541 epoxy adhesive also has high strength, heat resistance, and excellent electrical characteristics. Recommended curing conditions for epoxy patch red adhesive are 150 degrees Celsius; 90-120 seconds or 160-180 seconds at 120 ℃, with higher curing temperatures not exceeding 200 ℃.
usage method:
& nbsp;& nbsp;& nbsp; 1. Take out the glue from the refrigerator and let it equilibrate with the outside at room temperature for 1-2 hours.
& nbsp;& nbsp;& nbsp; 2. Use scraping or dispensing technology to apply glue to the surface of the cleaned printed circuit board. If used for bonding, both adhesives need to be coated with the adhesive< br />
& nbsp;& nbsp;& nbsp; 3. Heat up and solidify< br />
& nbsp;& nbsp;& nbsp; 4. After use, it should be promptly covered and stored in the refrigerator at 5 ℃.
matters needing attention:
1. The suitable printing speed for the product is 20-150mm/s, and the process varies depending on the selected product and the printing machine settings.
2. Better printing conditions are a temperature of 25 ℃ and a relative humidity not exceeding 70 ℃< br />
3. Curing tests should be conducted based on the actual curing conditions and the characteristics of the processed components to determine better curing conditions suitable for specific products< br />
4. uncured adhesives can be cleaned with isopropanol, acetone, butanone, or ester solvents< br />
5. This product is stored at 5 ℃~10 ℃ from the date of production and has a shelf life of 3 months. Beyond the storage period, if the viscosity is appropriate, it can still be used< br />
6. This product is non hazardous and should be stored and transported as such< br />
7. Packaging specification: 310m.
Product information:< br />
& nbsp; & nbsp; 5541 epoxy patch red adhesive has a fast curing speed. Epoxy patch adhesive has a very wide range of applications, even with high-speed coating and small amounts of coating, it can still maintain no wire drawing, tailing, or collapse, and has good adhesive point stability. SMT epoxy patch adhesive has extremely low moisture absorption, and is not prone to bubbles or insufficient adhesion under rapid heating and very short curing time. 5541 epoxy adhesive also has high strength, heat resistance, and excellent electrical characteristics. Recommended curing conditions for epoxy patch red adhesive are 150 degrees Celsius; 90-120 seconds or 160-180 seconds at 120 ℃, with higher curing temperatures not exceeding 200 ℃.
usage method:
& nbsp;& nbsp;& nbsp; 1. Take out the glue from the refrigerator and let it equilibrate with the outside at room temperature for 1-2 hours.
& nbsp;& nbsp;& nbsp; 2. Use scraping or dispensing technology to apply glue to the surface of the cleaned printed circuit board. If used for bonding, both adhesives need to be coated with the adhesive< br />
& nbsp;& nbsp;& nbsp; 3. Heat up and solidify< br />
& nbsp;& nbsp;& nbsp; 4. After use, it should be promptly covered and stored in the refrigerator at 5 ℃.
matters needing attention:
1. The suitable printing speed for the product is 20-150mm/s, and the process varies depending on the selected product and the printing machine settings.
2. Better printing conditions are a temperature of 25 ℃ and a relative humidity not exceeding 70 ℃< br />
3. Curing tests should be conducted based on the actual curing conditions and the characteristics of the processed components to determine better curing conditions suitable for specific products< br />
4. uncured adhesives can be cleaned with isopropanol, acetone, butanone, or ester solvents< br />
5. This product is stored at 5 ℃~10 ℃ from the date of production and has a shelf life of 3 months. Beyond the storage period, if the viscosity is appropriate, it can still be used< br />
6. This product is non hazardous and should be stored and transported as such< br />
7. Packaging specification: 310m.
